Solder paste 

Lead free solder paste Sn63/Pb37 product specification
SN-6C-631 (Sn63/Pb37)

Sb/Pb no-clean solder paste SN63/PB37 specifications
1 Overview SN6C-631 solder paste (Sn63/Pb37) is a no-clean solder paste that is suitable for ultra-fine process printing and reflow. Solder paste has a wide process window to provide surface mount process solutions for 01005 inch components. Excellent printing performance is available in 8 hours of use. The excellent reflow process window makes it possible to obtain a good soldering effect on the Cu OSP board even with a high wetting curve.

There is a good combination of print points of all sizes. Excellent resistance to collapse well inhibits the formation of irregular tin
beads. Solder joints are excellent in appearance and easy to visually inspect. Cavity performance reaches IPC CLASS III level and IPC flux is classified as ROL0 level to ensure product environmental protection and reliability.