Wafer Robot is designed to meet the demands of high-speed, exact handling in semiconductor manufacturing. This robot features single-arm and double-arm construction options, which can be customized according to user needs.

With advanced interpolation algorithms, the robot supports VIA (Inflection point) and is compatible with multiple FOUPs, making it versatile for various applications.

Item Specifications Specifications Actual indicators
-    Payload (End-effector + wafer / each wrist) 1.0kg 1.0kg 1.0kg
-    Range of Motion R-axis (extension) 737 mm  755 mm 755 mm 
-    θ-axis (rotation) 330 deg 330 deg 330 deg
-    Z-axis (elevation) 310 mm 300 mm 300 mm
-    Repeatability(300 times measured) R-axis (extension) p-p 0.1mm p-p 0.1mm p-p 0.1mm
-    θ-axis (rotation) p-p 0.1 deg p-p 0.1 deg p-p 0.1 deg
-    Z-axis (elevation) p-p 0.1mm p-p 0.1mm p-p 0.1mm
-    Maximum Speed(Acceleration/Deceleration time) R-axis (extension) 260deg/sec  260deg/sec  260deg/sec
-    θ-axis (rotation) 330deg/sec  330deg/sec  330deg/sec
-    Z-axis (elevation) 550mm/sec  550mm/sec  550mm/sec 
-    Linear motion  2000mm/s 2000mm/s 2000mm/s
-    Minimum rotation diameter 600 mm 600 mm 600mm
-    Path Trajectory ±1.8mm ±1.8mm ±1.65mm
-    Wafer Transfer Surface (With 300mm Wafer) p-p1.0mm p-p1.0mm P-P1.0mm

Honghu atmospheric transfer module introduction
-    Single-arm/double-arm construction, reversible, available on demand ;
-    The interpolation algorithm supports VIA (Inflection point) and supports multiple FOUPs ;
-    Full axis AC servo motor, 23bits absolute encoder ;
-    S-curve acceleration and deceleration motion control technology, to achieve high-speed, high-precision handling ;
-    General wafer fixing methods: vacuum adsorption, edge clamping;
-    Cleanliness level: ISO Class1;
-    Finger material: carbon fiber, aluminum alloy, high purity ceramics and other options;
-    According to the wafer material characteristics, the optimal holding scheme is designed and provided

Users can choose from materials like carbon fiber, aluminum alloy, and high-purity ceramics for the robot’s fingers, meet to the specific needs of the wafer material. This robot’s design incorporates these features to deliver optimal performance and reliability in wafer handling tasks.