Wafer Vacuum Transfer Module (VTM300) is a critical component used in various vacuum processes including wafer etching and deposition techniques such as CVD, PVD, and ALD. Designed to meet stringent process requirements, this module ensures ultra-high vacuum conditions, low vibration, and resistance to corrosion and high temperatures.

Manufactured by Honghu (Suzhou) Semiconductor Technology Co., Ltd, the VTM300 is engineered for reliability and performance. It features a welded tubular construction with a painted surface for durability. The module supports wafer transport with customizable options for process facets, load locks, and arm blades.

• Item HH400 HH500 HH600 HH700 HH800
  
• Frame Welded tubular construction with support,The surface is coated with white paint
  
• Wafer Transport Plane 1100mm(Per SEMI std.E 21-91)
  
• Process Facets
  
• Up to 3 Up to 3 Up to 4 Up to 5 Up to 6
  
• Vacuum Robot HHVRD3/4 HHVRD3/4 HHVRD3/4 HHVRD3/4 HHVRD3/4
  
• Arm Blade Customized according to customer specifications,;Optional:1 Blade,2 Blade and 4 Blade;Material optional
  
• Load Locks  Provides Load Locks(1 or 2) and Slot(1 or 2 or 4 etc) Number customization
  
• Lid View Ports Optional Lid Lift Mechanism Lid Lift Mechanism Lid Lift Mechanism Lid Lift Mechanism
  
• Option:Cooling Station,VPA Station or Separating Station 
  
• Optional Chamber
  
• AWC < 0.05mm < 0.05mm < 0.05mm < 0.05mm < 0.05mm
  
• Base Vacuum 5 x 10−8 Torr 5 x 10−8 Torr 5 x 10−8 Torr 5 x 10−8 Torr 5 x 10−8 Torr
  
• Leak Rate <1 x10−9std.cc/sec  He <1 x10−9std.cc/sec  He <1 x10−9std.cc/sec  He <1 x10−10std.cc/sec  He <1 x10−9std.cc/sec  He

For B2B buyers, the VTM300 provides a cost-effective solution with high-value performance. Bulk purchases and wholesale rates are available, ensuring competitive pricing for large orders. Direct inquiries for customization and bulk rates can optimize procurement for various applications.

Country of Origin: United States