Wafer Vacuum Transfer Module (VTM300) is a critical component used in various vacuum processes including wafer etching and deposition techniques such as CVD, PVD, and ALD. Designed to meet stringent process requirements, this module ensures ultra-high vacuum conditions, low vibration, and resistance to corrosion and high temperatures.

Manufactured by Honghu (Suzhou) Semiconductor Technology Co., Ltd, the VTM300 is designed for reliability and performance. It features a welded tubular construction with a painted surface for durability. The module supports wafer transport with customizable options for process facets, load locks, and arm blades.

• Item HH400 HH500 HH600 HH700 HH800
  
• Frame Welded tubular construction with support,The surface is coated with white paint
  
• Wafer Transport Plane 1100mm(Per SEMI std.E 21-91)
  
• Process Facets
  
• Up to 3 Up to 3 Up to 4 Up to 5 Up to 6
  
• Vacuum Robot HHVRD3/4 HHVRD3/4 HHVRD3/4 HHVRD3/4 HHVRD3/4
  
• Arm Blade Customized according to customer specifications,;Optional:1 Blade,2 Blade and 4 Blade;Material optional
  
• Load Locks  Provides Load Locks(1 or 2) and Slot(1 or 2 or 4 etc) Number customization
  
• Lid View Ports Optional Lid Lift Mechanism Lid Lift Mechanism Lid Lift Mechanism Lid Lift Mechanism
  
• Option:Cooling Station,VPA Station or Separating Station 
  
• Optional Chamber
  
• AWC < 0.05mm < 0.05mm < 0.05mm < 0.05mm < 0.05mm
  
• Base Vacuum 5 x 10−8 Torr 5 x 10−8 Torr 5 x 10−8 Torr 5 x 10−8 Torr 5 x 10−8 Torr
  
• Leak Rate <1 x10−9std.cc/sec  He <1 x10−9std.cc/sec  He <1 x10−9std.cc/sec  He <1 x10−10std.cc/sec  He <1 x10−9std.cc/sec  He

For B2B buyers, the VTM300 provides a cost-effective solution with high-value performance. Bulk purchases and wholesale rates are available, ensuring competitive pricing for large orders. Direct inquiries for customization and bulk rates can optimize procurement for various applications.